| Processor |
| Processor cores | 4 |
| Processor frequency | 3.6 GHz |
| Processor cache | 8.25 MB |
| Processor lithography | 14 nm |
| Processor codename | Cascade Lake |
| Processor family | Intel Xeon W |
| Memory bandwidth supported by processor (max) | 85.3 GB/s |
| Box | N |
| Processor ARK ID | 198018 |
| Cooler included | N |
| Intel Volume Management Device (VMD) | Y |
| Processor model | W-2223 |
| Processor threads | 8 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.9 GHz |
| Component for | Server/Workstation |
| Technical details |
| Vendor | Intel |
| Product type | Processor |
| Status | Launched |
| Launch date | Q4''19 |
| Bus speed | 0 GT/s |
| Weight & dimensions |
| Processor package size | 45 x 52.5 mm |
| Graphics |
| Discrete graphics card | N |
| On-board graphics card model | Not available |
| Discrete graphics card model | Not available |
| On-board graphics card | N |
| Processor special features |
| Intel® AES New Instructions (Intel® AES-NI) | Y |
| Enhanced Intel SpeedStep Technology | Y |
| Intel Trusted Execution Technology | Y |
| Intel VT-x with Extended Page Tables (EPT) | Y |
| Intel Demand Based Switching | Y |
| Intel TSX-NI | Y |
| Intel® Secure Key | Y |
| Intel 64 | Y |
| Intel® OS Guard | Y |
| Intel Virtualization Technology for Directed I (O (VT-d)) | Y |
| Intel Software Guard Extensions (Intel SGX) | N |
| Intel Virtualization Technology (VT-x) | Y |
| Intel Turbo Boost Max Technology 3.0 | N |
| Intel® Optane™ Memory Ready | N |
| Intel® Memory Protection Extensions (Intel® MPX) | Y |
| Intel® Speed Shift Technology | Y |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Boot Guard | Y |
| Intel® Deep Learning Boost | Y |
| Intel® vPro™ Platform Eligibility | Y |
| Intel® Deep Learning Boost (Intel® DL Boost) | Y |
| Intel® Volume Management Device (VMD) | Y |
| Intel® Identity Protection Technology (Intel® IPT) | Y |
| Intel® vPro™ Technology | Y |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Y |
| Intel® Turbo Boost Technology | 2.0 |
| Features |
| Execute Disable Bit | Y |
| Idle States | Y |
| Thermal Monitoring Technologies | Y |
| Scalability | 1S |
| CPU configuration (max) | 1 |
| Embedded options available | N |
| Maximum number of PCI Express lanes | 48 |
| Physical Address Extension (PAE) | Y 46 bit |
| Harmonized System (HS) code | 8542310001 |
| Supported instruction sets | SSE4.2,AVX,AVX 2.0,AVX-512 |
| PCI Express CEM revision | 3.0 |
| PCI Express slots version | 3.0 |
| Power |
| Thermal Design Power (TDP) | 120 W |
| Operational conditions |
| Tcase | 64 °C |
| Memory |
| ECC | Y |
| Maximum internal memory supported by processor | 1024 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2666 MHz |
| Memory channels | Quad |
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