| Processor |
| Processor cores | 4 |
| Processor cache | 6 MB |
| Processor manufacturer | Intel |
| Thermal Design Power (TDP) | 65 W |
| Processor lithography | 14 nm |
| Processor codename | Comet Lake |
| Processor cache type | Smart Cache |
| Processor family | 10th gen Intel® Core™ i3 |
| Memory bandwidth supported by processor (max) | 41.6 GB/s |
| Box | Y |
| Processor socket | LGA 1200 (Socket H5) |
| Processor ARK ID | 203474 |
| Processor base frequency | 3.7 GHz |
| Processor model | i3-10105F |
| System bus rate | 8 GT/s |
| Processor threads | 8 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.4 GHz |
| Component for | PC/Thin Client/Tablet |
| Technical details |
| Vendor | Intel |
| Status | Launched |
| Launch date | Q1''21 |
| Supported memory types | DDR4-SDRAM |
| Weight & dimensions |
| Processor package size | 37.5 x 37.5 mm |
| Other features |
| Maximum internal memory | 128 GB |
| Graphics |
| Discrete graphics card | N |
| On-board graphics card model | Not available |
| Discrete graphics card model | Not available |
| On-board graphics card | N |
| Processor special features |
| Intel® AES New Instructions (Intel® AES-NI) | Y |
| Enhanced Intel SpeedStep Technology | Y |
| Intel Trusted Execution Technology | N |
| Intel VT-x with Extended Page Tables (EPT) | Y |
| Intel® Secure Key | Y |
| Intel 64 | Y |
| Intel Stable Image Platform Program (SIPP) | N |
| Intel® OS Guard | Y |
| Intel Virtualization Technology for Directed I (O (VT-d)) | Y |
| Intel Software Guard Extensions (Intel SGX) | Y |
| Intel Virtualization Technology (VT-x) | Y |
| Intel Turbo Boost Max Technology 3.0 | N |
| Intel® Optane™ Memory Ready | Y |
| Intel® Boot Guard | Y |
| Intel® Thermal Velocity Boost | N |
| Intel® vPro™ Platform Eligibility | N |
| Intel® Transactional Synchronization Extensions | N |
| Intel® Turbo Boost Technology 2.0 frequency | 4.4 GHz |
| Intel® Identity Protection Technology (Intel® IPT) | Y |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Y |
| Intel® Turbo Boost Technology | 2.0 |
| Features |
| Execute Disable Bit | Y |
| Idle States | Y |
| Thermal Monitoring Technologies | Y |
| Scalability | 1S |
| CPU configuration (max) | 1 |
| Embedded options available | N |
| PCI Express configurations | 1x16,2x8,1x8+2x4 |
| Thermal solution specification | PCG 2015C |
| Maximum number of PCI Express lanes | 16 |
| Market segment | Desktop |
| Harmonized System (HS) code | 8542310001 |
| Supported instruction sets | SSE4.1,SSE4.2,AVX 2.0 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G077159 |
| PCI Express slots version | 3.0 |
| Operational conditions |
| Tjunction | 100 °C |
| Memory |
| ECC | N |
| Maximum internal memory supported by processor | 128 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2666 MHz |
| Memory bandwidth (max) | 41.6 GB/s |
| Memory channels | Dual-channel |
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