| Processor |
| Processor cores | 18 |
| Processor frequency | 3.1 GHz |
| Processor cache | 24.75 MB |
| Processor lithography | 14 nm |
| Processor codename | Cascade Lake |
| Processor family | Intel® Xeon® Gold |
| Box | N |
| Processor socket | LGA 3647 |
| Processor ARK ID | 192451 |
| Cooler included | N |
| Intel Volume Management Device (VMD) | Y |
| Processor model | 6254 |
| Processor threads | 36 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Component for | Server/Workstation |
| Technical details |
| Vendor | Intel |
| Product type | Processor |
| Status | Launched |
| Launch date | Q2''19 |
| Memory speed (max) | 2933 MHz |
| Number of UPI links | 3 |
| Weight & dimensions |
| Processor package size | 76.0 x 56.5 mm |
| Graphics |
| Discrete graphics card | N |
| On-board graphics card model | Not available |
| Discrete graphics card model | Not available |
| On-board graphics card | N |
| Processor special features |
| Intel® AES New Instructions (Intel® AES-NI) | Y |
| Enhanced Intel SpeedStep Technology | Y |
| Intel Trusted Execution Technology | Y |
| Intel VT-x with Extended Page Tables (EPT) | Y |
| Intel TSX-NI | Y |
| Intel 64 | Y |
| Intel Virtualization Technology for Directed I (O (VT-d)) | Y |
| Intel Virtualization Technology (VT-x) | Y |
| Intel Turbo Boost Max Technology 3.0 | N |
| Intel® Speed Shift Technology | Y |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Deep Learning Boost | Y |
| Intel® Optane™ DC Persistent Memory technology | Y |
| Intel® Resource Director Technology (Intel® RDT) | Y |
| Intel® Run Sure Technology | Y |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | N |
| Intel Speed Select Technology (SST) | N |
| Intel® vPro™ Platform Eligibility | Y |
| Mode-based Execute Control (MBE) | Y |
| Intel® vPro™ Technology | Y |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Y |
| Intel® Turbo Boost Technology | 2.0 |
| Features |
| Execute Disable Bit | Y |
| Scalability | 4S |
| Embedded options available | N |
| Maximum number of PCI Express lanes | 48 |
| Harmonized System (HS) code | 8542310001 |
| Supported instruction sets | AVX-512 |
| PCI Express CEM revision | 3.0 |
| PCI Express slots version | 3.0 |
| Power |
| Thermal Design Power (TDP) | 200 W |
| Operational conditions |
| Tcase | 82 °C |
| Memory |
| ECC | Y |
| Maximum internal memory supported by processor | 1024 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Memory channels | Hexa |
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